PCB manufacturing capabilities
| Item | Technical Data |
| Layers counts | 1-20 layers |
| MAX.dimension | 1200 x 800 mm |
| PCB | Rigid – Flex – Rigid/Flex |
| Material Base | BT Epoxy – Polyimide -Teflon – INVAR – Halogen Free – Hi Frequence – IMS – |
| Surface finish | Hal lead free – Immersion gold – Immersion Silver -Immersion Tin – Electrolytic gold – Graphite – Bonding NiAu |
| Board thickness | 2L 8mil |
| 4L 16mil | |
| 6L 32mil | |
| 8L 48mil | |
| 10L 60mil | |
| Min.line width | 3mil |
| Min.line space | 3mil |
| Min.hole size | 4mil |
|
Max. inner copper thickness Max. outer copper thickness |
3oz 10oz |
| PTH hole tolerance | ±3mil |
| Non-PTH hole tolerance | ±2mil |
|
Hole position tolerance Press fit tolerance |
±2mil ±2mil |
| Outline tolerance | ±4mil |
|
Min. solder bridge Impedance control tolerance |
3mil ±10% |
| Insulation resistance | 1×1012Ω(Normal) |
| Hole resistance | <300Ω(Normal) |
| Thermal shock | 3×10sec@288℃ |
| Warp & twist | ≤0.7% |
| Dielectric strength | >1.3KV/mm |
| Peel strength | 1.4N/mm |
| Solder mask abrasion | >6H |
| Open & short E-testing voltage | 50-330V |